Innovations and breakthroughs are continuously driven in semiconductor manufacturing to overcome existing assembly limitations and recurring difficulties. This paper is focused on the resolution of the delamination issue during die attach assembly process. A new design of semicon...
Open access
Research Article10.9734/jerr/2021/v20i417303
Electromagnetic interference (EMI) is an unwanted disturbance caused by external sources that would affect the electrical functionality of the device. This paper presents an advanced approach of electromagnetic interference (EMI) shielding protection for sensitive and critical se...
Open access
Research Article10.9734/jerr/2020/v19i417238
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and de...
Open access
Research Article10.9734/jerr/2020/v17i217182
The paper presents a practical procedure in selecting the best candidate for die attach epoxy control or anti-epoxy bleed-out (anti-EBO) concentration during the introduction of new leadframe configuration. Three different criteria were implemented to measure the relative impact...
Open access
Research Article10.9734/jerr/2020/v14i217121
The paper focused on the elimination of die crack occurrence at the diebond process. Design of experiment (DOE) was done on the pick and place rubber-tip design and an improved design was finalized. The improved rubber-tip configuration with smaller vacuum design and full contact...
Open access
Research Article10.9734/jerr/2020/v12i217074
Innovations and breakthroughs either through process, equipment or material is known in semiconductor industries as a positive option in overcoming the existing limitations and assembly handicaps. This presentation discusses the assembly methodology and packaging design of a quad...
Open access
Research Article10.9734/jerr/2019/v9i417026
Package thinning, down-scaling, and miniaturization are common interests among semiconductor industries, with each manufacturing site having different approach and technical directions in providing novelties in their products. The paper offers an innovative design of manufacturin...
Open access
Research Article10.9734/jerr/2019/v9i217014
Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richnes...
Open access
Research Article10.9734/jerr/2019/v4i216897
Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on t...
Open access
Research Article10.9734/jerr/2021/v20i817357
This paper presents the modification and improvement done on the wire clamp and top plate (WCTP) design to eliminate the bouncing effect of the silicon die that leads to smashed ball reject during the formation of wire. The protrusion of the unit on the vacuum hole produced movem...
Open access
Research Article10.9734/jerr/2020/v17i417195
This paper presents a modified substrate design that would enable a bottom electromagnetic interference (EMI) shielding protection for EMI sensitive integrated unit (IC). The modified substrate design is applied and incorporated to the existing and known shielding technique to fu...
Open access
Research Article10.9734/jerr/2020/v17i217184
This paper focused on the integration of metallized silicon die in design layout of quad-flat no-leads package (QFN) and ball grid array (BGA) devices. The metallized silicon die is fabricated with a conductive top layer where the junction for wire interconnection is created. The...
Open access
Research Article10.9734/jerr/2020/v14i417131
The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical singulation. The discussion provides a specialized design of mold chase for mold encapsulation process, and an augmented mechanical cutting tec...
Open access
Research Article10.9734/jerr/2020/v10i217033
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
Intermetallic is a critical factor that is controlled and limit during manufacturing of integrated units. Through improving the ball flatness response of the semiconductor wire significantly impact the outcome for the intermetallic characteristic between metal such as Gold-Alumin...
Open access
Research Article10.9734/jerr/2021/v20i217259
This paper presents an improvement in the design of quad flat no-leads (QFN) leadframe material to reduce the amount of unit rejection due to excessive leadframe warpage observed after die attach curing (DAC) process. The enhanced leadframe design includes modification through in...
Open access
Research Article10.9734/jerr/2020/v10i217035
With the new die technology becomes smaller and thinner, silicon die circuit metallization also becomes smaller, thus electronic devices like quad-flat no-leads multi-row (QFN-mr) semiconductor leadframe package design become more sensitive and prone to electrostatic discharge (E...
Open access
Research Article10.9734/jerr/2020/v14i317126
The paper focused on the evaluation of quad-flat no-leads (QFN) semiconductor package with small silicon die on different machine platforms to achieve a higher bond line thickness (BLT) of greater than 30 µm. The characterization or evaluation was narrowed down into two main dieb...
Open access
Research Article10.9734/jerr/2020/v14i217119