Die Attach Process Optimization with Enhanced Epoxy Control on Leadframe Package
Rennier S. Rodriguez, Edwin M. Graycochea Jr, Rammil A. Seguido, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 32–37 · Published 7 Jul 2020
10.9734/jerr/2020/v14i217121Abstract
The paper presents a practical procedure in selecting the best candidate for die attach epoxy control or anti-epoxy bleed-out (anti-EBO) concentration during the introduction of new leadframe configuration. Three different criteria were implemented to measure the relative impact of the anti-EBO into the different interfaces inside a quad-flat no-leads multi-row (QFN-mr) leadframe unit. Die shear test is performed to measure the shear strength and the compatibility of the anti-EBO to the adhesive material. EBO measurement is performed herewith to study the propagation of epoxy bleed-out on the surface of the leadframe with reference to the different level of anti-EBO concentration. Package reliability is employed study the response of different interfaces directly in-contact with anti-EBO through thermal-cycling scenario. Ultimately, understanding the effect of anti-EBO into different set of tests provided a systematic way of selecting appropriate leadframe parameters for QFN-mr leadframe product.
References (5)
- 1 Electronic Packaging and Interconnection Handbook
- 2 Trends of Power Electronic Packaging and Modeling [DOI]
- 3 Dicing die attach challenges at multi die stack packages [DOI]
- 4 Die attach capability on ultra thin wafer thickness for power semiconductor [DOI]
- 5 Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe [DOI]
Cited by 8
Rennier S. Rodriguez, Frederick Ray I. Gomez, Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2020
Jerome Dinglasan, Rogel Dela Rosa, Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Jerome J. Dinglasan, Leandro D. Saria, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Jerome J. Dinglasan, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Rogel Dela Rosa, Jerome J. Dinglasan, F. Gomez · Journal of Engineering Research and Reports · 2021
Showing 5 of 8 known citations — external sources report more than can currently be individually listed.
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