Pick and Place Process Optimization for Thin Semiconductor Packages
Rennier S. Rodriguez, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 1–9 · Published 14 Mar 2019
10.9734/jerr/2019/v4i216897Abstract
Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements. Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.
References (5)
- 1 Handbook of Semiconductor Manufacturing Technology [DOI]
- 2 Pick-and-Place Silver Sintering Die Attach of Small-Area Chips [DOI]
- 3 Die attach capability on ultra thin wafer thickness for power semiconductor [DOI]
- 4 Elimination of ESD Events and Optimizing Waterjet Deflash Process for Reduction of Leakage Current Failures on QFN-mr Leadframe Devices [DOI]
- 5 Achieving high speed RFID die pick and place operation [DOI]
Cited by 18
Rennier S. Rodriguez, Maiden Grace R. Maming, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020
B. C. Bacquian, F. R. Gomez · Journal of Engineering Research and Reports · 2020
Edwin M. Graycochea Jr., Frederick Ray I. Gomez, Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020
A. Sumagpang Jr., E. Graycochea Jr., F. R. Gomez · Journal of Engineering Research and Reports · 2020
E. Graycochea Jr., F. Gomez, R. Rodriguez, B. Bacquian · Journal of Engineering Research and Reports · 2020
Rennier Rodriguez, Frederick Ray Gomez · Journal of Engineering Research and Reports · 2020
Allen Jay D. Kumawit, Maria Virginia S. Buera, Mariane A. Mendoza, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Hai-Bo Fan, Peilun Yao, Hai-Bin Chen · International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems · 2023
Allen Jay D. Kumawit, Mariane A. Mendoza · Journal of Engineering Research and Reports · 2022
Peilun Yao, Hai-Bin Chen, Jinglei Yang · International Conference on Electronic Packaging Technology · 2021
Showing 17 of 18 known citations — external sources report more than can currently be individually listed.
Related research
- Design and Construction of a GSM-Controlled Pick and Place Robot — shares topic coverage
- Pick and Place Process Defect Mitigation on Semiconductor BGA Device — shares topic coverage
- Wafer Preparation Parameter Optimization for Wafer Defects Elimination — shares topic coverage
- Laser DAF Cut Augmentation for Thin Wafers — shares topic coverage
- Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages — shares topic coverage
Article metrics
Real usage data collected on this platform.
102
Page views
0
PDF downloads
29
Outbound clicks
18
Citations
Views over time
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
Traffic sources
Referring site, by host.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.