Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
Rennier S. Rodriguez, Frederick Ray I. Gomez, Bryan Christian S. Bacquian
Journal of Engineering Research and Reports · pp. 1–6 · Published 30 Sep 2020
10.9734/jerr/2020/v17i217182Abstract
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and dents, uneven bonding of die, localized insufficient epoxy, and misaligned die encountered during the conversion and setup stage. The implementation of the augmented design improves the current assembly practice through eliminating the replacement of anvil block that is the cause of misalignment on the indexer handler of the die attach machine. Through this design, the selection of appropriate vacuum hole setup can be through the sliding insert only without pulling out the anvil block from the machine.
References (3)
- 1 Handbook of Semiconductor Manufacturing Technology [DOI]
- 2 Dicing die attach challenges at multi die stack packages [DOI]
- 3 Die Attach Process Optimization with Enhanced Epoxy Control on Leadframe Package [DOI]
Cited by 4
Marque Ryan Salcedo, Alyssa Grace Gablan, Jerome Dinglasan, Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Alyssa Grace Gablan, Jerome Dinglasan, Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
R. Rodriguez, F. Gomez, E. Graycochea · 2021
Showing 3 of 4 known citations — external sources report more than can currently be individually listed.
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