Addressing Delamination through Advanced Semiconductor Die Design
Rennier S. Rodriguez, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 142–146 · Published 31 Mar 2021
10.9734/jerr/2021/v20i417303Abstract
Innovations and breakthroughs are continuously driven in semiconductor manufacturing to overcome existing assembly limitations and recurring difficulties. This paper is focused on the resolution of the delamination issue during die attach assembly process. A new design of semiconductor die is presented to establish a robust adhesion or interface bonding between the silicon die and the epoxy material for die attach. The paper also provides the specialized design of manufacturing flow for the improved die design through advanced wafer fabrication method and wafer cutting technique. The realization of the advanced silicon die design would ultimately mitigate the delamination issue and would contribute for a robust die attach assembly process.
References (8)
- 1 Die Attach Materials for High Temperature Applications: A Review [DOI]
- 2 Pick-and-Place Silver Sintering Die Attach of Small-Area Chips [DOI]
- 3 Meeting the assembly challenges in new semiconductor packaging trend [DOI]
- 4 Dicing die attach challenges at multi die stack packages [DOI]
- 5 Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation [DOI]
- 6 No-bleed die attach adhesives [DOI]
- 7 Low stress die attach material challenges for critical Si node with Cu wire [DOI]
- 8 Process Enhancement to Eliminate Adhesive Film Remains during Die Picking [DOI]
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