Process Enhancement to Eliminate Adhesive Film Remains during Die Picking
E. Graycochea Jr., B. C. Bacquian, F. R. Gomez
Journal of Engineering Research and Reports · pp. 1–4 · Published 25 Mar 2020
10.9734/jerr/2020/v11i317057Abstract
Adhesive film remains on the dicing tape is one of the problems encountered in diebonding or die attach process during the pick-up process of silicon dies. With this occurrence, one method used to identify the root cause is the process mapping from wafer preparation to diebonding. Adhesive film remains are found occurring during the process, affecting the manufacturability and assembly yield of the semiconductor package. By resorting to a new and improved die attach adhesive film material, occurrence of its remains was mitigated during the diebonding process.
Cited by 8
Antonio R. Sumagpang Jr., Frederick Ray I. Gomez, Edwin M. Graycochea Jr. · Journal of Engineering Research and Reports · 2020
Bryan Christian S. Bacquian, Edwin M. Graycochea Jr., Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020
Rennier S. Rodriguez, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
F. R. Gomez, R. Rodriguez · Journal of Engineering Research and Reports · 2021
R. Rodriguez, F. Gomez, M. G. Maming · 2020
Showing 5 of 8 known citations — external sources report more than can currently be individually listed.
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