Silicon Die with Integrated Epoxy for Improved Interface Adhesion
Journal of Engineering Research and Reports · pp. 50–53 · Published 15 Jun 2021
10.9734/jerr/2021/v20i817358Abstract
Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.
References (9)
- 1 Die Attach Materials for High Temperature Applications: A Review [DOI]
- 2 Dicing die attach challenges at multi die stack packages [DOI]
- 3 Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation [DOI]
- 4 An analysis on oxidation, contamination, adhesion, mechanical stress and electro- etching effect toward DIP package delamination [DOI]
- 5 No-bleed die attach adhesives [DOI]
- 6 Low stress die attach material challenges for critical Si node with Cu wire [DOI]
- 7 Process Enhancement to Eliminate Adhesive Film Remains during Die Picking [DOI]
- 8 Improvement on Semiconductor Substrate Design with Package Modeling and Simulation for Mitigation of Delamination and Voids [DOI]
- 9 Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs [DOI]
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