Improvement on Semiconductor Substrate Design with Package Modeling and Simulation for Mitigation of Delamination and Voids
Frederick Ray I. Gomez & Rammil A. Seguido · Journal of Engineering Research and Reports · 2018
This technical paper presents the challenges encountered in the development of a compact and thinner package that incorporates multiple or stacked dice in one. For the case of this paper, Die1 (bottom die) is smaller than Die2 (top die) and must be the first one to be die-bonded,...
Open access
Research Article
10.9734/jerr/2018/v2i416712