Assembly Wirebond Process Solution for Mitigating Leadframe Bouncing on Multi-Die QFN Device
Raymond Albert A. Narvadez, Frederick Ray I. Gomez, Anthony R. Moreno, Edwin M. Graycochea Jr.
Journal of Engineering Research and Reports · pp. 7–12 · Published 29 Jun 2021
10.9734/jerr/2021/v20i917369Abstract
Modification and improvement of an existing tooling design in semiconductor packaging industry has been a usual practice, to enhance the current setup and to provide a solution to a specific assembly problem. This paper discusses the solution in eliminating the smashed ball defect occurrence observed after wirebond process. Smashed ball is usually encountered if the unit is unstable and creates a bouncing effect during wirebond process. It is therefore important to mitigate this micro-bouncing effect by analyzing the package design and the window clamp and top plate (WCTP). The objective is to increase the stability of the unit during wirebonding, especially for quad-flat no-leads (QFN) package with no tape. To achieve this, the solution is to alter the vacuum hole design of the top plate from single hole per unit to multiple holes of varied sizes per unit. Ultimately, after changing the design of the top plate, the micro-bouncing encountered during wirebond process was significantly reduced. This in turn created a consistent ball formation in all bonded wires. The comparative data presented in this paper confirmed the effectivity of the redesigned WCTP. For future works and studies, the improvement and learnings could be used on devices with comparable configuration.
References (4)
- 1 Meeting the assembly challenges in new semiconductor packaging trend [DOI]
- 2 Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads [DOI]
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- 4 Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation [DOI]
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