Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on t...
Open access
Research Article10.9734/jerr/2021/v20i817357
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
This paper presents an improvement in the design of quad flat no-leads (QFN) leadframe material to reduce the amount of unit rejection due to excessive leadframe warpage observed after die attach curing (DAC) process. The enhanced leadframe design includes modification through in...
Open access
Research Article10.9734/jerr/2020/v10i217035
With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key directi...
Open access
Research Article10.9734/jerr/2020/v19i317231
The paper focused on the improvement done in quad-flat no-leads (QFN) leadframe package assembly to address the quantity of rejection of crumpled leadframe during handling at wirebond process station. Overload sensor at the output magazine handler was found out to be defective, h...
Open access
Research Article10.9734/jerr/2020/v19i217226
The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF)...
Open access
Research Article10.9734/jerr/2020/v17i317189
With the new die technology becomes smaller and thinner, silicon die circuit metallization also becomes smaller, thus electronic devices like quad-flat no-leads multi-row (QFN-mr) semiconductor leadframe package design become more sensitive and prone to electrostatic discharge (E...
Open access
Research Article10.9734/jerr/2020/v14i317126
Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critica...
Open access
Research Article10.9734/jerr/2020/v12i417084
With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during...
Open access
Research Article10.9734/jerr/2020/v17i317187
One of the challenging assembly processes in semiconductor manufacturing industry is stencil printing using solder paste as direct material. With this technology, some issues were encountered during the development phase of an advanced leadframe device and one of which is the sol...
Open access
Research Article10.9734/jerr/2020/v16i417176
New design for a certain issue in semiconductor industry is another way to modify the standard configuration into specified limit or to make a possible solution of the problem. This paper presents a new modified design for wirebond top plate with a bias platform structure that w...
Open access
Research Article10.9734/jerr/2019/v9i317021