Raymond Albert A. Narvadez

Assembly Wirebond Process Solution for Mitigating Leadframe Bouncing on Multi-Die QFN Device

Raymond Albert A. Narvadez, Frederick Ray I. Gomez, Anthony R. Moreno & Edwin M. Graycochea Jr. · Journal of Engineering Research and Reports · 2021

Modification and improvement of an existing tooling design in semiconductor packaging industry has been a usual practice, to enhance the current setup and to provide a solution to a specific assembly problem. This paper discusses the solution in eliminating the smashed ball defec...

Open access Research Article 10.9734/jerr/2021/v20i917369

Addressing the Broken Wire Issue during the Assembly Manufacturing of QFN Leadframe Device

Raymond Albert A. Narvadez, Freddie B. Folio, Frederick Ray I. Gomez & Jonathan C. Pulido · Journal of Engineering Research and Reports · 2021

The integrity of the assembly wirebond process’ 2nd bond poses a big challenge for semiconductor manufacturing of quad-flat no-leads (QFN) devices, particularly on multiple wires on a lead. These devices are vulnerable to induce or obtain broken wire at heel defect. This type of...

Open access Research Article 10.9734/jerr/2021/v20i817363