Intermetallic is a critical factor that is controlled and limit during manufacturing of integrated units. Through improving the ball flatness response of the semiconductor wire significantly impact the outcome for the intermetallic characteristic between metal such as Gold-Alumin...
Open access
Research Article10.9734/jerr/2021/v20i217259
Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critica...
Open access
Research Article10.9734/jerr/2020/v12i417084
This study aims to develop polyimide etching process on the silicon die after decapsulation to resolve the wire shear issue during ball shear data gatherings. The shear strength of the ball is affected by the presence of polyimide insulator during ball shearing process, due to th...
Open access
Research Article10.9734/jerr/2020/v12i117073
This technical paper presents a study of wirebond selection highlighting the package electrical modeling and simulation done for semiconductor integrated circuit (IC) leadframe package (hereinafter referred to as Device Z) with different wirebond configurations: Gold 2N 1.3 mil,...
Open access
Research Article10.9734/jerr/2019/v7i316970
Modification and improvement of an existing tooling design in semiconductor packaging industry has been a usual practice, to enhance the current setup and to provide a solution to a specific assembly problem. This paper discusses the solution in eliminating the smashed ball defec...
Open access
Research Article10.9734/jerr/2021/v20i917369
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design soluti...
Open access
Research Article10.9734/jerr/2021/v20i317273