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Research Article Open access CC BY 4.0

Understanding Jig Alignment Error Occurrences for Substrate 1-Map Strips

Mariane A. Mendoza, Maria Virginia S. Buera, Frederick Ray I. Gomez, Allen Jay D. Kumawit

Journal of Engineering Research and Reports · pp. 113–118 · Published 10 Jul 2021

10.9734/jerr/2021/v20i917380

Abstract

Singulation is a process in a semiconductor industry where high dense strips were singulated into single units. Jig saw singulation was the updated technology where strips were seated and vacuumed on a rubber nest jig during singulation. Jig saw singulation is also practical for high volume manufacturing as it demands minimal indirect materials. To cut the strips, jig alignment with the strip was measured by the machine to ensure that the rubber nest jig will not be cut and damaged while the strip is being singulated. However, with the different upstream process that the strip undergone, machine prompt frequent jig alignment errors when the machine detected that the strip saw street has high displacement with the recorded alignment of the saw street of rubber nest jig. Through this study, the authors have driven to understand the jig alignment errors occurrences as well as the assistance that can be made for the strip to be processed. The authors also included the study of the risks that might be imposed on both rubber nest jig and the affected strips, as well as the recommendations when jig alignment errors were encountered.

1-map strip jig alignment error jig saw singulation singulation process

References (5)

  1. 1 Enhanced Die Attach Process Defect Recognition on QFN Leadframe Packages [DOI]
  2. 2 Strip warpage assessment of dual side molding SiP module [DOI]
  3. 3 An Introduction of Strip Chopping Cut Method to Establish a Robust Strip Based Dicing Process on Tape Dicing Concept [DOI]
  4. 4 Warpage and Wire Sweep Analysis of QFN Molded Strip using Experimental and Modeling Methods [DOI]
  5. 5 Warpage Mitigation through Diebond Process Improvement with Enhanced Leadframe Configuration [DOI]

Cited by 4

Understanding the Cause and Effect of Bent Side Rail in Molding Process

Mariane Mendoza, Maria Virginia Buera, Joel Pablo, Jerome Dinglasan · Journal of Engineering Research and Reports · 2022

Validation of New Substrate Design for the Improvement of Strip Warpage on LGA Packages

Jerome Dinglasan, Mariane Mendoza · Journal of Engineering Research and Reports · 2022

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