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Mariane A. Mendoza

Publications (7)

Wire Length Formulation Using Wire Density, Volume and Weight for Hand Calculation and Verification of Wire Usage

Mariane A. Mendoza · Journal of Engineering Research and Reports · 2022

Wire Bonding process uses precious materials such as gold, silver, and copper wires to create a connection from the die to the strip and completing the circuitry of a semiconductor unit. Wire consumption is identified by length that is consumed per unit and higher consumption lea...

Open access Research Article 10.9734/jerr/2022/v23i12766

Process Simplification on Integration of UV Cure Machine with Tape Saw Singulation

Mariane A. Mendoza, Alyssa Grace S. Gablan, Hardy L. Tierra & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

Strips that have undergone tape saw singulation will not be completed without the ultraviolet (UV) curing process. To detach the units from the tape, the singulated strips have required further assistance to be loaded for UV cure. Otherwise, hard-to-pick units will be the outcome...

Open access Research Article 10.9734/jerr/2021/v20i1017382

Understanding Jig Alignment Error Occurrences for Substrate 1-Map Strips

Mariane A. Mendoza, Maria Virginia S. Buera, Frederick Ray I. Gomez & Allen Jay D. Kumawit · Journal of Engineering Research and Reports · 2021

Singulation is a process in a semiconductor industry where high dense strips were singulated into single units. Jig saw singulation was the updated technology where strips were seated and vacuumed on a rubber nest jig during singulation. Jig saw singulation is also practical for...

Open access Research Article 10.9734/jerr/2021/v20i917380

Redesigned Chuck Table: Deep-grooved Chuck Table for Higher Vacuum Suction of Singulated Package

Allen Jay D. Kumawit & Mariane A. Mendoza · Journal of Engineering Research and Reports · 2022

Singulation machine frequently encounters Z-Picker errors and occasionally, worst case of unit scattering which leads on the gross unit rejection and scrappage. As analyzed, shifted units found on the chuck table module upon singulation of strip. Shifted units were induced on the...

Open access Research Article 10.9734/jerr/2022/v23i217591

Pattern Recognition System Program Advancement to Compensate Strip Expansion on 1-Map Strips

Maria Virginia S. Buera, Mariane A. Mendoza & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

Package singulation process is where the whole strip was sheared to produce individual units. Existing singulation program for 1-map strip have only six (6) pattern recognition system (PRS) points along the whole strip with 240 mm length. Considering the length of the strip, it i...

Open access Research Article 10.9734/jerr/2021/v20i717349

Proactive Verification of Strip Y-Index to Mitigate Gross Misaligned Cut due to Mismatched Unit Pitching

Maria Virginia S. Buera, Mariane A. Mendoza & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

Shopfloor practices that when the first cut line was aligned with the hairline, actual blade cut, and saw street of the strip, the succeeding cut lines will automatically follow with the same alignment. Considering various factors that affect the condition of the strip, it was re...

Open access Research Article 10.9734/jerr/2021/v20i717337

Different Vacuum Pad Design Effects with Z-Picker Assembly

Allen Jay D. Kumawit, Maria Virginia S. Buera, Mariane A. Mendoza & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

After singulation process where the strips are being cut into single units, unit tray loading comes next. Unit tray loading is the process where the singulated units will be picked up from the table and then place it in a tray pocket. Z-picker assembly executes the pick and placi...

Open access Research Article 10.9734/jerr/2021/v20i817364