Resolution of Low IMC on Multi-Stacked Dice Device with Different Bond Pads
Freddie B. Folio, Roy B. Guingab, Frederick Ray I. Gomez, Jonathan C. Pulido
Journal of Engineering Research and Reports · pp. 13–17 · Published 30 Jun 2021
10.9734/jerr/2021/v20i917370Abstract
The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stacked dice configurations with baseline reference using same die technology. The only difference is the substrate layout in which defined for the electrical purpose. The challenge is to understand and resolve low intermetallic coverage (IMC) on each die which may lead to manufacturability and reliability problems over time.
Cited by 0
No indexed citations yet.
Related research
- Bond Pad Probe Marks Effect on Intermetallic Coverage — shares topic coverage
- Enhanced Ball Shear Testing Configuration For Substrate LGA Sensor Devices — shares topic coverage
- Elimination of Intermetallic Coverage Over-etching on Aluminum Pad — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.