Resolution of Low IMC on Multi-Stacked Dice Device with Different Bond Pads
Freddie B. Folio, Roy B. Guingab, Frederick Ray I. Gomez & Jonathan C. Pulido · Journal of Engineering Research and Reports · 2021
The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stack...
Open access
Research Article
10.9734/jerr/2021/v20i917370