Freddie B. Folio

Resolution of Low IMC on Multi-Stacked Dice Device with Different Bond Pads

Freddie B. Folio, Roy B. Guingab, Frederick Ray I. Gomez & Jonathan C. Pulido · Journal of Engineering Research and Reports · 2021

The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stack...

Open access Research Article 10.9734/jerr/2021/v20i917370

Addressing the Broken Wire Issue during the Assembly Manufacturing of QFN Leadframe Device

Raymond Albert A. Narvadez, Freddie B. Folio, Frederick Ray I. Gomez & Jonathan C. Pulido · Journal of Engineering Research and Reports · 2021

The integrity of the assembly wirebond process’ 2nd bond poses a big challenge for semiconductor manufacturing of quad-flat no-leads (QFN) devices, particularly on multiple wires on a lead. These devices are vulnerable to induce or obtain broken wire at heel defect. This type of...

Open access Research Article 10.9734/jerr/2021/v20i817363