Machine Capability Enhancement to Address Lacking Epoxy Coverage during Die Attach Process of QFN Packages
Journal of Engineering Research and Reports · pp. 17–24 · Published 29 Jun 2022
10.9734/jerr/2022/v22i1017569Abstract
Epoxy coverage on die attach process is one of the important characteristics of a QFN semiconductor product. Epoxy condition on a die contributes to the product performance physically and electrically. Complete epoxy coverage satisfies the manufacturing requirement and resulting to customer’s confidence. As the products becomes complex and innovative, certain difficulties are met on the production line. Incomplete epoxy coverage caused by epoxy hardening cannot be prevented as minor machine aid and other unscheduled machine idle time are present. This manuscript will discuss and focus on how to address the said phenomenon by automation principle and augmented process with the idea of industry 4.0.
References (8)
- 1 Die attach capability on ultra thin wafer thickness for power semiconductor [DOI]
- 2 Methods to achieve zero human error in semiconductors manufacturing [DOI]
- 3 Process characterization of highly conductive silver paste die attach materials for thin die on QFN [DOI]
- 4 Bond Line Thickness Characterization for QFN Package Robustness [DOI]
- 5 Elimination of epoxy bridging in diebond process [DOI]
- 6 Die Attach Pre-bond Inspection Innovation for Roughened Leadframe [DOI]
- 7 Establishing Robust Control for Epoxy Open Time [DOI]
- 8 A Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages [DOI]
Cited by 1
Chien-Yi Huang, Chao-Chieh Chan, Chih-Yang Weng · Microelectronics Reliability · 2025
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