Epoxy coverage on die attach process is one of the important characteristics of a QFN semiconductor product. Epoxy condition on a die contributes to the product performance physically and electrically. Complete epoxy coverage satisfies the manufacturing requirement and resulting...
Open access
Research Article10.9734/jerr/2022/v22i1017569
Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process durin...
Open access
Research Article10.9734/jerr/2021/v20i817356
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper...
Open access
Research Article10.9734/jerr/2021/v20i617333
Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have...
Open access
Research Article10.9734/jerr/2021/v20i617326
As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless...
Open access
Research Article10.9734/jerr/2021/v20i517313
Innovation on die attach curing process on semiconductor industry play a big role to have a robust process eliminating unwanted gross unit rejection. Resolving failures and hardware breakdowns on the exhaust system of oven curing process are the focus of this paper. Discoloration...
Open access
Research Article10.9734/jerr/2021/v20i1117406
Strip mapping for unit level traceability on die attach process of semiconductor companies provide quality driven impression for end users on the market. On processing of Micro electromechanical system packages, strip map generated by operators manually, certain errors and discre...
Open access
Research Article10.9734/jerr/2021/v21i517464