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Jerome J. Dinglasan

Publications (4)

Defining an Optimized Machine Process Sequence to Address Broken Wafer Phenomenon on Semiconductor Products

Jerome J. Dinglasan · Journal of Engineering Research and Reports · 2021

Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process durin...

Open access Research Article 10.9734/jerr/2021/v20i817356

A Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages

Jerome J. Dinglasan, Leandro D. Saria & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper...

Open access Research Article 10.9734/jerr/2021/v20i617333

Conceptualized Improvement on Transparent Glass Die for a Robust Manufacturing Process

Jerome J. Dinglasan, Frederick Ray I. Gomez & Alyssa Grace S. Gablan · Journal of Engineering Research and Reports · 2021

Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have...

Open access Research Article 10.9734/jerr/2021/v20i617326

Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

Jerome J. Dinglasan & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless...

Open access Research Article 10.9734/jerr/2021/v20i517313