Pick and Place Process Optimization for Thin Semiconductor Packages
Rennier S. Rodriguez, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 1–9 · Published 14 Mar 2019
10.9734/jerr/2019/v4i216897Abstract
Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements. Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.
Cited by 17
E. Graycochea, F. Gomez, R. Rodriguez · 2020
B. C. Bacquian, F. Gomez · 2020
B. C. Bacquian, F. Gomez · 2020
E. Graycochea, F. Gomez, R. Rodriguez · 2020
F. Gomez, R. Rodriguez, N. Gomez · 2020
R. Rodriguez, M. G. Maming, F. Gomez · 2020
Allen Jay D. Kumawit, Maria Virginia S. Buera, Mariane A. Mendoza · 2021
Related research
- Design and Construction of a GSM-Controlled Pick and Place Robot — shares topic coverage
- Pick and Place Process Defect Mitigation on Semiconductor BGA Device — shares topic coverage
- Wafer Preparation Parameter Optimization for Wafer Defects Elimination — shares topic coverage
- Laser DAF Cut Augmentation for Thin Wafers — shares topic coverage
- Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
17
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.