Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
Bryan Christian S. Bacquian, Edwin M. Graycochea Jr., Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 28–32 · Published 16 Oct 2020
10.9734/jerr/2020/v17i317189Abstract
The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF) bleed out on the die paddle of the leadframe. This reject manifestation was seen after die attach process. Parameter optimization particularly for the bonding with the combination of bond force and bond time parameter was done to eliminate this type of issue after die attach process. With this die attach process optimization and improvement done, DAF bleed out occurrence was eliminated with 100% reduction improvement.
Cited by 0
No indexed citations yet.
Related research
- Pick and Place Process Optimization for Thin Semiconductor Packages — shares topic coverage
- Wafer Preparation Parameter Optimization for Wafer Defects Elimination — shares topic coverage
- Laser DAF Cut Augmentation for Thin Wafers — shares topic coverage
- Warpage Mitigation through Diebond Process Improvement with Enhanced Leadframe Configuration — shares topic coverage
- A Study of Dispense Needle for Die Attach Voids Mitigation — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.