A Study of Micro-crack on Surface Mount IC Package
Antonio Sumagpang Jr., Frederick Ray Gomez, Edwin Graycochea Jr.
Journal of Engineering Research and Reports · pp. 19–24 · Published 25 May 2020
10.9734/jerr/2020/v12i417086Abstract
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected the assembly yield performance of the device in focus. Process mapping and defect concentration diagram were done to isolate the location of the defect and the processes involved. Containment and corrective actions were employed to fully narrow down the defect occurrence. Finally, a 99% improvement on defect parts per million (ppm) reduction was observed after implementation of all corrective actions.
Cited by 0
No indexed citations yet.
Related research
- Non-destructive Microcracks Detection Techniques in Silicon Solar Cell — shares topic coverage
- Process Enhancement to Eliminate Adhesive Film Remains during Die Picking — shares topic coverage
- Specialized Wirebond Process Configuration on Advanced Multi-Die Package — shares topic coverage
- Tool Setup Improvement for Package Scratch Mitigation at End-of-Line Process — shares topic coverage
- Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.