The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach proc...
Open access
Research Article10.9734/jerr/2020/v19i117224
The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing o...
Open access
Research Article10.9734/jerr/2020/v15i317144
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...
Open access
Research Article10.9734/jerr/2021/v20i517310
New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major mac...
Open access
Research Article10.9734/jerr/2021/v20i517306
The paper presents a modified design for wafer level semiconductor devices, using a CAD (computer-aided design) tool for visualization. The discussion provides a specialized manufacturing flow for the augmented die design through advanced wafer fabrication method and wafer cuttin...
Open access
Research Article10.9734/jerr/2021/v20i617329
In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the a...
Open access
Research Article10.9734/jerr/2021/v20i217270
The paper focused on the improvement done in leadframe design to address the copper (Cu) burrs defect in assembly manufacturing. Newly qualified device struggled to hit the target yield due to the said Cu burrs defect. A holistic approach through why-why analysis was performed b...
Open access
Research Article10.9734/jerr/2020/v15i417150
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents an improvement done in quad-flat no-leads (QFN) leadframe package to resolve the quantity of unit rejection due to leads scratch under...
Open access
Research Article10.9734/jerr/2020/v15i117136
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected...
Open access
Research Article10.9734/jerr/2020/v12i417086