This paper presents an advanced design of Quad-Flat No-leads (QFN) and Quad-Flat Package (QFP) leadframe to mitigate the propagation of delamination between high stress level areas particularly the mold-to-leads interface. The integration of through-hole mechanism on leadframe pr...
Open access
Research Article10.9734/jerr/2020/v14i317124
Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amou...
Open access
Research Article10.9734/jerr/2020/v10i117031
Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and...
Open access
Research Article10.9734/jerr/2021/v20i917367
The paper presents a modified design for wafer level semiconductor devices, using a CAD (computer-aided design) tool for visualization. The discussion provides a specialized manufacturing flow for the augmented die design through advanced wafer fabrication method and wafer cuttin...
Open access
Research Article10.9734/jerr/2021/v20i617329
Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality produc...
Open access
Research Article10.9734/jerr/2021/v20i517309
In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the a...
Open access
Research Article10.9734/jerr/2021/v20i217270
The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned...
Open access
Research Article10.9734/jerr/2020/v16i317167
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed th...
Open access
Research Article10.9734/jerr/2020/v16i317166
The paper focused on the improvement done in leadframe design to address the copper (Cu) burrs defect in assembly manufacturing. Newly qualified device struggled to hit the target yield due to the said Cu burrs defect. A holistic approach through why-why analysis was performed b...
Open access
Research Article10.9734/jerr/2020/v15i417150
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents an improvement done in quad-flat no-leads (QFN) leadframe package to resolve the quantity of unit rejection due to leads scratch under...
Open access
Research Article10.9734/jerr/2020/v15i117136
The continuing growth and development on semiconductor package miniaturization have become a particular interest and focus semiconductor industry. The importance of thinner packages also demands a thinner vertical structure of the integrated circuit (IC) design with silicon die o...
Open access
Research Article10.9734/jerr/2020/v14i417129
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected...
Open access
Research Article10.9734/jerr/2020/v12i417086
The paper aimed to mitigate wafer defects such as large kerf shifting issue, dice pop-out occurrence and edge cut defects in the wafer preparation or pre-assembly stage of integrated circuits (IC) assembly manufacturing. With the introduction of new wafer preparation technologies...
Open access
Research Article10.9734/jerr/2020/v12i117071
The mechanical interlocking structure for quad-flat no-lead (QFN) assembly for densified leadframe degrades as the package becomes thinner. Detractors such as package reliability and design requirement hinder further qualification of leadframes with increased number of input/outp...
Open access
Research Article10.9734/jerr/2020/v12i117069
The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge i...
Open access
Research Article10.9734/jerr/2020/v10i117029
Glass material used on a semiconductor device for isolating currents are one of the new breakthroughs of the modern world. Challenges are inevitable due to its complex characteristics and unique appearance. The study focuses on the phenomenon of reject glass die unrecognized, pic...
Open access
Research Article10.9734/jerr/2021/v20i817365
Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cros...
Open access
Research Article10.9734/jerr/2021/v20i817355
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability...
Open access
Research Article10.9734/jerr/2021/v20i717351
Tape saw singulation is the process where a strip was mounted on the tape attached on the frame and then sawn into single units. Circular tape saw singulation only caters one panel of the two-paneled strip which was found to be consuming with the machine capacity and resources. D...
Open access
Research Article10.9734/jerr/2021/v20i717341
The rise of various Wafer technologies has been developed based on industries and applications requirement. Highest quality of material characterization is complex and requires specialized process equipment and manufacturing procedures to meet defined design standards. The paper...
Open access
Research Article10.9734/jerr/2021/v20i617332
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...
Open access
Research Article10.9734/jerr/2021/v20i517310
New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major mac...
Open access
Research Article10.9734/jerr/2021/v20i517306
In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconduc...
Open access
Research Article10.9734/jerr/2021/v20i417304
The paper presents a study on the effect of semiconductor die’s bond pad probe marks on the interface between the wire and the bond pad. The probe marks are quantified in terms of percentage area in the bond pad, while the interface strength between the wire of Gold material to t...
Open access
Research Article10.9734/jerr/2021/v20i117253
The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach proc...
Open access
Research Article10.9734/jerr/2020/v19i117224
The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing o...
Open access
Research Article10.9734/jerr/2020/v15i317144
With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this p...
Open access
Research Article10.9734/jerr/2020/v12i217078
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line proce...
Open access
Research Article10.9734/jerr/2021/v20i317286