The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned...
Open access
Research Article10.9734/jerr/2020/v16i317167
The paper focused on the improvement done in leadframe design to address the copper (Cu) burrs defect in assembly manufacturing. Newly qualified device struggled to hit the target yield due to the said Cu burrs defect. A holistic approach through why-why analysis was performed b...
Open access
Research Article10.9734/jerr/2020/v15i417150
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected...
Open access
Research Article10.9734/jerr/2020/v12i417086
With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this p...
Open access
Research Article10.9734/jerr/2020/v12i217078