Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation
Antonio Sumagpang Jr., Rennier Rodriguez, Frederick Ray Gomez
Journal of Engineering Research and Reports · pp. 37–45 · Published 4 May 2020
10.9734/jerr/2020/v12i217078Abstract
With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this paper focused on the elimination of non-stick on pad (NSOP) assembly defect at the wirebond process. Fishbone analysis and why-why analysis were done to comprehensively investigate the root-cause and eventually address the problem. High NSOP rejection rate was identified to be attributed to clamp and insert design, and was verified through series of analysis, design of experiment (DOE) and validation runs. Results revealed that by using the modified clamp and insert design with more holes would address NSOP rejection with around 90% defect reduction.
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