Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cros...
Open access
Research Article10.9734/jerr/2021/v20i817355
The paper presents a modified design for wafer level semiconductor devices, using a CAD (computer-aided design) tool for visualization. The discussion provides a specialized manufacturing flow for the augmented die design through advanced wafer fabrication method and wafer cuttin...
Open access
Research Article10.9734/jerr/2021/v20i617329
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...
Open access
Research Article10.9734/jerr/2021/v20i517310
In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the a...
Open access
Research Article10.9734/jerr/2021/v20i217270
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed th...
Open access
Research Article10.9734/jerr/2020/v16i317166
The mechanical interlocking structure for quad-flat no-lead (QFN) assembly for densified leadframe degrades as the package becomes thinner. Detractors such as package reliability and design requirement hinder further qualification of leadframes with increased number of input/outp...
Open access
Research Article10.9734/jerr/2020/v12i117069
The paper presents a study on the effect of semiconductor die’s bond pad probe marks on the interface between the wire and the bond pad. The probe marks are quantified in terms of percentage area in the bond pad, while the interface strength between the wire of Gold material to t...
Open access
Research Article10.9734/jerr/2021/v20i117253
The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach proc...
Open access
Research Article10.9734/jerr/2020/v19i117224
The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing o...
Open access
Research Article10.9734/jerr/2020/v15i317144
This paper presents an advanced design of Quad-Flat No-leads (QFN) and Quad-Flat Package (QFP) leadframe to mitigate the propagation of delamination between high stress level areas particularly the mold-to-leads interface. The integration of through-hole mechanism on leadframe pr...
Open access
Research Article10.9734/jerr/2020/v14i317124
With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this p...
Open access
Research Article10.9734/jerr/2020/v12i217078
The absent of reliable production controls for Die Attach Film (DAF) voids detection allowed defect escapee for Ball Grid Array (BGA) devices using non-conductive film material leading to gross assembly rejection and customer complaints. This paper presents the evaluation of pres...
Open access
Research Article10.9734/jerr/2020/v10i417047
Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amou...
Open access
Research Article10.9734/jerr/2020/v10i117031