Wire Shorting Elimination through Wirebond Process Optimization of Semiconductor Sensor Device
Anthony Moreno, Edwin Graycochea Jr., Frederick Ray Gomez
Journal of Engineering Research and Reports · pp. 10–14 · Published 22 Jun 2020
10.9734/jerr/2020/v13i417108Abstract
New and upcoming semiconductor devices and technologies are getting more challenging in assembly manufacturing process due to many factors such as complex package layout, process capability and critical bill of materials. This paper focused on the mitigation of the top major assembly reject of a semiconductor sensor device, that is the wire-to-wire shorting issue at wirebonding process. Parameter optimization particularly the looping segment 1 parameter, as well as using a reverse stitch on ball (RSOB) were employed to eliminate the wire-to-wire defect in wirebonding process. Finally, with the process optimization and improvement, a reduction of 98 percent wire-to-wire shorting occurrence was attained.
Cited by 7
Irish Beltran, Mark Anthony Ramiro, Jerome J. Dinglasan · Journal of Engineering Research and Reports · 2022
Jonathan C. Pulido, R. Rodriguez, F. Gomez · 2021
A. Moreno, F. Gomez, R. Rodriguez · 2021
A. Moreno, E. Graycochea, F. Gomez · 2020
A. Moreno, F. Gomez, E. Graycochea · Electronic Packaging Technology Conference · 2020
Jonathan C. Pulido, R. Rodriguez, F. Gomez · 2020
F. Gomez, R. Rodriguez · 2020
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