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Research Article Open access CC BY 4.0

Incorporating Package Grinding Process for QFN Thin Device Manufacturing

Rennier S. Rodriguez, Frederick Ray I. Gomez

Journal of Engineering Research and Reports · pp. 1–6 · Published 2 Jan 2020

10.9734/jerr/2019/v9i217014

Abstract

Package thinning, down-scaling, and miniaturization are common interests among semiconductor industries, with each manufacturing site having different approach and technical directions in providing novelties in their products. The paper offers an innovative design of manufacturing flow to reduce the semiconductor package height of a Quad-Flat No-leads (QFN) device through the application of a specialized package grinding process.  The process would significantly reduce the carrier thickness for the overall package height configuration of QFN. Through this integration, the common assembly barriers and defects related in producing thin devices are eliminated, thus thinner version manufacturing becomes more simplified and efficient.

QFN QFN multi-row package grinding leadframe design

Cited by 8

Implementation of Pads Re-layout for QFN Multi-row Breakthrough

R. Rodriguez, F. Gomez, M. G. Maming · 2020

Modified Sidewall Design of QFN Package

F. Gomez, R. Rodriguez · 2020

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