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Research Article Open access CC BY 4.0

Package and Process Design Augmentation of QFN Leadframe Device

Rennier S. Rodriguez, Maiden Grace R. Maming, Frederick Ray I. Gomez

Journal of Engineering Research and Reports · pp. 1–6 · Published 21 Jan 2020

10.9734/jerr/2019/v9i417026

Abstract

Innovations and breakthroughs either through process, equipment or material is known in semiconductor industries as a positive option in overcoming the existing limitations and assembly handicaps. This presentation discusses the assembly methodology and packaging design of a quad-flat no-leads (QFN) devices using grid design molding tool and leadframe with exposed copper tie bar. Realization of this improved package design proposed the removal of mechanical blade as the primary cutting technique of separating the molded leadframes likewise assembly rejection and defect related to the mechanical blade material together with the processing limitations is mitigated as well. Furthermore, the improved design is realized to be a better alternative for manufacturing tighter clearances and unit-unit pitching requirement thus supports densified and critical package design.

Leadframe design QFN package singulation etching process.

Cited by 2

A Chip-on-Board Packaging Scheme for Amorphous-Wire GMI Magnetic Sensors

Qianzhen Su, Ze-Peng Wang, Bo Zhang · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 2026

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