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Research Article Open access CC BY 4.0

Die Attach Curing Program Automation of N2 Parameter for Process Robustness

Jerome Dinglasan, Rogel Dela Rosa, Frederick Ray Gomez

Journal of Engineering Research and Reports · pp. 147–152 · Published 31 Mar 2021

10.9734/jerr/2021/v20i417304

Abstract

In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconductor integrated circuits (IC) devices, certain problems occur like wrong Nitrogen (N2) parameter setting on the oven curing machine, with human intervention during setup, causing leadframe oxidation related defects. The paper discussed the importance of automation system on processing semiconductor IC products on die attach curing process, eliminating mostly human intervention on setting up machine parameters, storing and managing programs, restrict unauthorize users from accessing, provide friendly user procedures to prevent human errors and prevent oxidation related defects.

Automation die attach process error-proofing oven curing

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