Land grid array or LGA package of semiconductor has been commonly used on our modern technology, from home gadgets up to industrial uses. Improvements to correct product defects and process issues are introduced to have quality products for customer satisfaction. Substrate warpag...
Open access
Research Article10.9734/jerr/2022/v23i317600
Glass material used on a semiconductor device for isolating currents are one of the new breakthroughs of the modern world. Challenges are inevitable due to its complex characteristics and unique appearance. The study focuses on the phenomenon of reject glass die unrecognized, pic...
Open access
Research Article10.9734/jerr/2021/v20i817365
In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconduc...
Open access
Research Article10.9734/jerr/2021/v20i417304
The rise of various Wafer technologies has been developed based on industries and applications requirement. Highest quality of material characterization is complex and requires specialized process equipment and manufacturing procedures to meet defined design standards. The paper...
Open access
Research Article10.9734/jerr/2021/v20i617332
Wirebond quality aspects on a semiconductor manufacturing is one of the key factors to be considered in having a robust product. Certain criteria are defined, met, and affects the output on the product. Other variables from downstream process are also taken in account to affect t...
Open access
Research Article10.9734/jerr/2022/v22i217522
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line proce...
Open access
Research Article10.9734/jerr/2021/v20i317286
During processing of Quad Flat No-lead (QFN) on the production line, it has been observed that strips were found with bent rails after the molding process. Mold is a process in the semiconductor industry where package encapsulation happens by filling the cavities with molding com...
Open access
Research Article10.9734/jerr/2022/v22i1117573