Die Attach Curing Program Automation of N2 Parameter for Process Robustness
Jerome Dinglasan, Rogel Dela Rosa & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconduc...
Open access
Research Article
10.9734/jerr/2021/v20i417304