The optimum mercerization parameters for treatment of corn husk using NaOH were analyzed by response surface methodology (RSM). The surface morphology and chemical structures of the raw and NaOH-treated fibers were studied using scanning electron microscopy (SEM), X-ray diffracti...
Open access
Research Article10.9734/jerr/2021/v20i317284
Die crack is one of the problems in stacked die semiconductor packages. As silicon dies become thinner in such packages due to miniaturization requirement, the tendency to have die crack increases. This study presents the investigation done on a die crack issue in a stacked die p...
Open access
Research Article10.9734/jerr/2021/v20i317285
In the leadframe package assembly process, silicon die is attached to the leadframe using a die attach adhesive material and the bonded strip is then cured. However, excessive strip warpage after the die attach cure process is a challenging problem that also affects the succeedin...
Open access
Research Article10.9734/jerr/2021/v20i317281
The Open time is called the time it takes for this chemical transition from liquid to solid. The epoxy moves into a gel state from the liquid state as it recovers, until it enters a solid-state. This article will address the development of a new, regulatory-compliant in die attac...
Open access
Research Article10.9734/jerr/2021/v20i317280
This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a m...
Open access
Research Article10.9734/jerr/2021/v20i317279
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
The study was conducted to determine the mathematical skills and the academic performance of the junior and senior electrical engineering students of the University of Eastern Philippines. Descriptive-correlational method of research was used with a total enumeration of the regul...
Open access
Research Article10.9734/jerr/2021/v20i317276
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article10.9734/jerr/2021/v20i317277
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design soluti...
Open access
Research Article10.9734/jerr/2021/v20i317273
This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack sign...
Open access
Research Article10.9734/jerr/2021/v20i317274