Flood frequency analysis is a crucial component of flood risk management which seeks to establish a quantile relationship between peak discharges and their exceedance (or non-exceedance) probabilities, for planning, design and management of infrastructure in river basins. This pa...
Open access
Research Article10.9734/jerr/2021/v20i517315
As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless...
Open access
Research Article10.9734/jerr/2021/v20i517313
Strip warpage is a common problem in molded leadframe packages. When warpage becomes excessive, the strip could not be processed as it would result in the strip being stuck or damaged during loading to the handling machine loader. This study focuses on the impact of mold cap thic...
Open access
Research Article10.9734/jerr/2021/v20i517312
Thinner semiconductor package is becoming popular especially in consumer electronics applications. As package becomes thinner, it is more vulnerable to package crack when subjected to external load. It is important to ensure that the package is strong enough to resist package cra...
Open access
Research Article10.9734/jerr/2021/v20i517311
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...
Open access
Research Article10.9734/jerr/2021/v20i517310
Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...
Open access
Research Article10.9734/jerr/2021/v20i517308
Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality produc...
Open access
Research Article10.9734/jerr/2021/v20i517309
Die crack is a common problem in the semiconductor industry and being able to predict the breaking force at a given loading condition could help prevent such crack problem. This paper presents the use of mechanical simulation in predicting the force at which the silicon die break...
Open access
Research Article10.9734/jerr/2021/v20i517307
New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major mac...
Open access
Research Article10.9734/jerr/2021/v20i517306
This paper will discuss how to reduce (IDM) Indirect Material consumption for derailing process by eliminating the manual derailing method as part of cost saving project. It involves the removal of cutter blade used for derail.Cost improvement was one of organizational goals of t...
Open access
Research Article10.9734/jerr/2021/v20i517305