Solder joint reliability is very important to ensure that an integrated circuit (IC) semiconductor package is functional within its intended life span as the solder joint establishes electrical connection between the IC and the printed circuit board (PCB). Solder fatigue failure...
Open access
Research Article10.9734/jerr/2021/v20i417295
The cooling rate of molten cast iron can make or mar it. The cooling rate plays a significant role in the resulting mechanical properties of cast iron. It determines the grain growth and size. The mechanical properties of cast iron variation along its length are achieved either w...
Open access
Research Article10.9734/jerr/2021/v20i417292
The aim of this work was to synthesize polyaluminum ferric chloride coagulant with significant coagulation performance employing K-feldspar/NaOH leaching residue as precursor. Potassium extraction from K-feldspar through sodium hydroxide calcination method is carried out at optim...
Open access
Research Article10.9734/jerr/2021/v20i417293
Shear strength is the essential engineering property of soil required to analyze and design foundations, retaining walls, bridges, embankment, and related infrastructure. The laboratory equipment and field instruments are not sufficient in developing countries to obtain soil engi...
Open access
Research Article10.9734/jerr/2021/v20i417291
The present study assessed water quality parameters and attempts to compare four different Water Quality Indexes (WQIs) for consistency, similarity and reliability in assessing the water quality of river Benue -an inland river- under wet and dry seasons. The results demonstrate t...
Open access
Research Article10.9734/jerr/2021/v20i417290
This study aims to address the problem of machine saturation and low capacity at package singulation, caused by increasing product loading and new devices that requires frequent machine setups and conversions. With this evaluation, the process and equipment engineering group coll...
Open access
Research Article10.9734/jerr/2021/v20i317289
Osuagwu Andrew Chima, Nkeleme Emmanuel Ifeanyichukwu, Amafili Tochukwu Nnamdi, Ike Goodluck Chukwuemeka & Nzeneri Oluchukwu Precious-favour·Journal of Engineering Research and Reports·2021
The maintenance of public building is evasive without a conscious practice of building surveying as it avails the maintenance personal insight that informs the building maintenance this The research evaluates the practice of building \surveying in South-East Nigeria and its im...
Open access
Research Article10.9734/jerr/2021/v20i317288
This study focuses on eliminating the lead pullback problem in an automotive quad flat no lead (QFN) package in order to meet the non-negotiable requirement to have a solder wettable or solderable lead sidewall. It involves using a non-traditional approach of Monte Carlo toleranc...
Open access
Research Article10.9734/jerr/2021/v20i317287
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line proce...
Open access
Research Article10.9734/jerr/2021/v20i317286
Wirebonding is one of the most challenging assembly manufacturing processes in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to mitigate misplaced ball issues and prevent pattern recognition alignment errors. Parameter optimizat...
Open access
Research Article10.9734/jerr/2021/v20i317283