In unconfined aquifer water flows in both horizontal and vertical direction when pumping. So its study during pumping action is more complex. Soil type, porosity, hydraulic conductivity and transmissivity are important parameters that control the specific yield, drawdown and radi...
Open access
Research Article10.9734/jerr/2021/v20i717346
This paper discusses the modeling approach used in improving the solder joint reliability prediction for Quad Flat No Lead (QFN) packages. A new power equation fatigue prediction model was developed based on the accumulated creep strain energy density from FEA (finite element ana...
Open access
Research Article10.9734/jerr/2021/v20i717344
This paper introduces modeling and simulation of the harmonic and intermodulation distortions of semiconductor laser radiating an optical fiber link. The study is based on the rate equation model of semiconductor lasers excited by injection current with two sinusoidal tones separ...
Open access
Research Article10.9734/jerr/2021/v20i717342
Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Ali...
Open access
Research Article10.9734/jerr/2021/v20i717343
Stainless steel is an alloy of steel which contains at least 10.5% chromium, less than 1.2% carbon, and other alloying elements. It is widely used in many industries globally and their properties are highly influenced by their microstructure, heat treatment or by plastic deformat...
Open access
Research Article10.9734/jerr/2021/v20i717339
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to of...
Open access
Research Article10.9734/jerr/2021/v20i717340
Tape saw singulation is the process where a strip was mounted on the tape attached on the frame and then sawn into single units. Circular tape saw singulation only caters one panel of the two-paneled strip which was found to be consuming with the machine capacity and resources. D...
Open access
Research Article10.9734/jerr/2021/v20i717341
Shopfloor practices that when the first cut line was aligned with the hairline, actual blade cut, and saw street of the strip, the succeeding cut lines will automatically follow with the same alignment. Considering various factors that affect the condition of the strip, it was re...
Open access
Research Article10.9734/jerr/2021/v20i717337
The flooding of River Rima is an annual issue affecting farmland located within the floodplains. This phenomena causes loss of farm produce and mass destruction of buildings, including roads and bridges in the area. Estimating the farmland affected by the flood will help the poli...
Open access
Research Article10.9734/jerr/2021/v20i717338
Different materials such as glass and composite cladding panels are common in the façade industry due to their architectural appearance. The direct sun rays enter the building and might produce discomfort to the occupants, especially in office and institutional buildings. Nowaday...
Open access
Research Article10.9734/jerr/2021/v20i617335