Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process durin...
Open access
Research Article10.9734/jerr/2021/v20i817356
Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cros...
Open access
Research Article10.9734/jerr/2021/v20i817355
This paper addresses two important useful extensions of binary reliability techniques to multi-state reliability techniques, namely: (a) the problem of complementation or inversion of the function of system success to that of system failure (or equivalently, of deriving the logic...
Open access
Research Article10.9734/jerr/2021/v20i817354
The paper industry around the world is in search for new ways to decrease production costs. New approached with additives such as new developed In Situ precipitated paper fillers materials have the potential to reduce production cost and increase profit margins. In Situ precipita...
Open access
Research Article10.9734/jerr/2021/v20i817352
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet...
Open access
Research Article10.9734/jerr/2021/v20i817353
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability...
Open access
Research Article10.9734/jerr/2021/v20i717351
Package singulation process is where the whole strip was sheared to produce individual units. Existing singulation program for 1-map strip have only six (6) pattern recognition system (PRS) points along the whole strip with 240 mm length. Considering the length of the strip, it i...
Open access
Research Article10.9734/jerr/2021/v20i717349
Semiconductor Companies and Industries soar high as the trend for electronic gadgets and devices increases. Transition from “manual” to “fully automatic” application is one of the advantages why consumer adapt to changes and prefer electronic devices as one of daily answers. Indi...
Open access
Research Article10.9734/jerr/2021/v20i717350
This paper utilizes a modern regular and modular eight-variable Karnaugh map in a systematic investigation of cause-effect relationships modeled by partially-defined Boolean functions (PDBF) (known also as incompletely specified switching functions). First, we present a Karnaugh-...
Open access
Research Article10.9734/jerr/2021/v20i717348
Rice aggregation centers are tasked with checkmating substandard agricultural produce that are often encountered by the integrated millers during the course of buying from farm to farm to ensure already made market for their produce. Thus, it must be well placed to occupy strateg...
Open access
Research Article10.9734/jerr/2021/v20i717347