The Flyback converter topology is a well-known and widely used for AC-DC and DC-DC power converters that cover a broad-spectrum including switching power supplies, photovoltaic (PV) system, electric cars, and fuel cell-based generation systems, and among other applications. In th...
Open access
Research Article10.9734/jerr/2021/v20i917376
Oil viscosity is one of the most important physical and thermodynamic property used when considering reservoir simulation, production forecasting and enhanced oil recovery. Traditional experimental procedure is expensive and time consuming while correlations are replete however t...
Open access
Research Article10.9734/jerr/2021/v20i917375
This investigation deals with a comparison of suction/injection effect on flow, heat and mass transfer in porous media using a combined similarity-numerical solution. With this method of transformation, the governing transport PDEs are transformed into ODE and then solved numeric...
Open access
Research Article10.9734/jerr/2021/v20i917374
Equipment failures have implication on financial sustainability of the organization. This showcase the fact that equipment failures have cost implications and there is need to convert failures using Failure Modes and Effect Analysis, FMEA numerical analysis of 3parameters of seve...
Open access
Research Article10.9734/jerr/2021/v20i917373
An experimental investigation was conducted to evaluate the impact of different curing practices on the porosity and compressive strength of concrete. The targeted compressive strength of the concrete at 28-day of curing was 20 N/mm2. Plain concrete cubes were prepared with a mix...
Open access
Research Article10.9734/jerr/2021/v20i917371
The particle swarm optimization (PSO) is a population-based algorithm belonging into metaheuristic algorithms and it has been used since many decades for handling and solving various optimization problems. However, it suffers from premature convergence and it can easily be trappe...
Open access
Research Article10.9734/jerr/2021/v20i917372
The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stack...
Open access
Research Article10.9734/jerr/2021/v20i917370
Modification and improvement of an existing tooling design in semiconductor packaging industry has been a usual practice, to enhance the current setup and to provide a solution to a specific assembly problem. This paper discusses the solution in eliminating the smashed ball defec...
Open access
Research Article10.9734/jerr/2021/v20i917369
Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and...
Open access
Research Article10.9734/jerr/2021/v20i917367
Self-service vehicles can combine data to boost the understanding of that of other cars, and thus improve safety drive and identification performance. However, it is burdensome to share in between autonomous vehicles, because due to the quantity of data generated by different veh...
Open access
Research Article10.9734/jerr/2021/v20i917368