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Research Article Open access CC BY 4.0

Elimination of Intermetallic Coverage Over-etching on Aluminum Pad

Jonalyn Jaylo-Sia, Jonathan Pulido, Frederick Ray Gomez

Journal of Engineering Research and Reports · pp. 153–156 · Published 26 May 2021

10.9734/jerr/2021/v20i717351

Abstract

Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability stresses. The challenging approach in IMC analysis detect as over-etching around IMC area that leads to inaccurate IMC data collection. To address the over-etching, we generate a new method which is backside polishing that results to a reliable IMC data collection and help reduced the cycle time of IMC data gathering.

Acid dripping backside polishing intermetallic coverage over-etching

References (6)

  1. 1 Selective Plasma Etching of Polymeric Substrates for Advanced Applications [DOI]
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  6. 6 Bond Pad Probe Marks Effect on Intermetallic Coverage [DOI]

Cited by 1

Resolution of Low IMC on Multi-Stacked Dice Device with Different Bond Pads

Freddie B. Folio, Roy B. Guingab, F. Gomez · 2021

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