Pick-and-place (PnP) rubber tip is used for the die attach process in semiconductor packaging. During the die attach process involving a very thin integrated circuit (IC) die, voids in the die attach film (DAF) adhesive were observed. This paper presents the modeling study conduc...
Open access
Research Article10.9734/jerr/2021/v20i217269
In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the a...
Open access
Research Article10.9734/jerr/2021/v20i217270
Very thin semiconductor package is very prone to package crack. This paper discusses the stress modeling study conducted to understand the package crack problem in a specific smart card package. Finite element analysis (FEA) was used to analyze the maximum package stress level an...
Open access
Research Article10.9734/jerr/2021/v20i217271
This paper discusses the characterization of an integrated circuit (IC) silicon die fracture strength to have a realistic die crack assessment. The evaluation was conducted using a 3-point bend test setup to measure the die strength of actual IC dies. Both the active side and the...
Open access
Research Article10.9734/jerr/2021/v20i217267
This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study ai...
Open access
Research Article10.9734/jerr/2021/v20i217266
Hydrological response of a catchment is a function of rainfall as influenced by catchment characteristics comprising geomorphology, land cover, and management practices. In this study, the analysis mainly focused on how geomorphological characteristics influence the catchment hyd...
Open access
Research Article10.9734/jerr/2021/v20i217268
Aeronautical navigation systems installed at specific locations within Saudi Arabia report the actual observed data of the times to failure (TTFs) for many types of engineering elements made by some typical international highly-acclaimed manufacturers. There is a need to compare...
Open access
Research Article10.9734/jerr/2021/v20i217265
This paper will discuss how package voids Mold defect was addressed on thinner Compression mold packages like BGA (Ball Grid Array) and Sensor Devices. Significant action was the application of “Rey Resin Dispense” pattern in compression mold granule compound dispensing was a key...
Open access
Research Article10.9734/jerr/2021/v20i217264
This study presents three different mathematical models for profit optimization of agricultural products in Bangladesh. The prime focus of the paper has been to develop a Mixed Integer Linear Programming (MILP) model and analyze this model for two situation of demand uncertainty....
Open access
Research Article10.9734/jerr/2021/v20i217262
The trend for use of rooftop solar photovoltaics (PV) is rising due to their promising economic potential as a source of clean renewable energy. In general, a source of renewable solar energy consists of solar PV, an automatic charge controller, a battery pack, and an inverter. T...
Open access
Research Article10.9734/jerr/2021/v20i217263