The Open time is called the time it takes for this chemical transition from liquid to solid. The epoxy moves into a gel state from the liquid state as it recovers, until it enters a solid-state. This article will address the development of a new, regulatory-compliant in die attac...
Open access
Research Article10.9734/jerr/2021/v20i317280
This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a m...
Open access
Research Article10.9734/jerr/2021/v20i317279
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
The study was conducted to determine the mathematical skills and the academic performance of the junior and senior electrical engineering students of the University of Eastern Philippines. Descriptive-correlational method of research was used with a total enumeration of the regul...
Open access
Research Article10.9734/jerr/2021/v20i317276
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article10.9734/jerr/2021/v20i317277
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design soluti...
Open access
Research Article10.9734/jerr/2021/v20i317273
This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack sign...
Open access
Research Article10.9734/jerr/2021/v20i317274
Interface adhesion tests are conducted to obtain a quantitative value of the adhesion strength or interface fracture toughness to forecast initiation and propagation of interface delamination failures in semiconductor packages. One of the common methods of fracture mechanics inte...
Open access
Research Article10.9734/jerr/2021/v20i217282
This paper will discuss the improvement made to increase machine capacity in order to be prepare for incoming demand ramp-up and to free up machine allocation to back-up automotive machine. Using DMAIC methodology (Define, Measure, Analyze, Improve and Control) approach, mold cur...
Open access
Research Article10.9734/jerr/2021/v20i217272
Package delamination is one of the problems in semiconductor packaging. Understanding the delamination mechanism in a specific situation is very important to identify the root cause and implement robust solution. In this study, package deformation modeling was done to analyze the...
Open access
Research Article10.9734/jerr/2021/v20i217278