Robotic application is taking new dimensions around the globe, of which numerous problems are solved with embedded systems, this research introduces gradient vertices method from 3D geometric to perform data capturing using kinematic effect with aid of autopilot Intelligent Robot...
Open access
Research Article10.9734/jerr/2020/v19i417237
In the Semiconductor Industry, the delamination performance of integrated circuit packaging is being aggressively improved. However, this task is complicated and difficult, as the defective failure is highly dependent on the compatibility of the material characteristics that may...
Open access
Research Article10.9734/jerr/2020/v19i417236
Rubberwood, hitherto solely employed as fuel wood has found fairly suitable use in the Nigerian construction industry. This paper investigated the engineering properties of this low cost, alternative, timber material, produced from Rubber trees (Hevea brasiliensis); often employe...
Open access
Research Article10.9734/jerr/2020/v19i317235
The current concerns of energy shortage and global warming have brought the development of strategies to utilize renewable energy resources at the forefront of public interest. Solar power is one of renewable energy's most promising sources. Concentrated photovoltaics can signifi...
Open access
Research Article10.9734/jerr/2020/v19i317232
Stencil printing using solder paste material is one of the challenging processes in semiconductor assembly manufacturing. During evaluation of a semiconductor device, off-centered ball issue was encountered. The study aimed to mitigate the off-centered ball issue at stencil pr...
Open access
Research Article10.9734/jerr/2020/v19i317233
Aims: This study examines the possibility of using seawater as an alternative to freshwater in concrete mixing and curing in areas prone to saltwater. The study was as a result of shortage and scarcity of Freshwater in some parts of the world; mostly in the coastal areas, where s...
Open access
Research Article10.9734/jerr/2020/v19i317234
With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key directi...
Open access
Research Article10.9734/jerr/2020/v19i317231
The areas of Free Space Optical (FSO) communication and high-speed Visible Light Communication (VLC) offer potential for very high-speed data transmission. Favorable attributes including high frequency and wider bandwidths that can enable transmission speeds of the order 100Gb/s,...
Open access
Research Article10.9734/jerr/2020/v19i217227
One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on...
Open access
Research Article10.9734/jerr/2020/v19i217228
Optimal allocation of shunt capacitors in the radial distribution networks results in both technical and economic benefits. This paper presents a two-stage method of Loss Sensitivity Factor (LSF) and Cuckoo Search Algorithm (CSA) to find the optimal size and location of shunt cap...
Open access
Research Article10.9734/jerr/2020/v19i217229