Advanced Semiconductor Design through Specialized Printable Conductive Layer
Rennier Rodriguez, Frederick Ray Gomez, Maiden Grace Maming
Journal of Engineering Research and Reports · pp. 43–47 · Published 4 Jun 2020
10.9734/jerr/2020/v13i217099Abstract
Semiconductor package miniaturization and thinning have become of particular interest among semiconductor manufacturing industries, with each manufacturing company having specific approach and technical directions in providing unique solutions in their products. The paper provides a specialized design of manufacturing flow for semiconductor device through advanced fabrication method using stencil printing. The advanced process would significantly reduce the carrier thickness for the overall package height configuration of the device. The implementation of the specialized design and process would mitigate common assembly barriers and defects related in producing thin devices, hence, enabling cost-saving realization and manufacturing solution to package thinning and miniaturization with multiple input/output (I/O) requirements.
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