Wirebond Process Improvement through Silicon  Die Polyimide Removal

Anthony R. Moreno; Jonalyn E. Jaylo; Frederick Ray I. Gomez; Edwin M. . Graycochea Jr

doi:10.9734/jerr/2020/v12i117073

Research Article Open access CC BY 4.0

Wirebond Process Improvement through Silicon Die Polyimide Removal

Anthony R. Moreno, Jonalyn E. Jaylo, Frederick Ray I. Gomez, Edwin M. . Graycochea Jr

Journal of Engineering Research and Reports · pp. 33–37 · Published 13 Apr 2020

10.9734/jerr/2020/v12i117073

Abstract

This study aims to develop polyimide etching process on the silicon die after decapsulation to resolve the wire shear issue during ball shear data gatherings. The shear strength of the ball is affected by the presence of polyimide insulator during ball shearing process, due to the polyimide layer of the silicon die being coplanar with the ball height of the wire. Experimentation and statistical analysis were done on units with and without polyimide coating, with Sodium Hydroxide (NaOH) used to remove the excess polyimide. Results revealed that silicon dice without polyimide coating resulted to better reading in terms of ball shear.

Sodium hydroxide semiconductor polyimide silicon die ball shear.

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Anthony R. Moreno, Jonalyn E. Jaylo, Frederick Ray I. Gomez, Edwin M. . Graycochea Jr (2020). Wirebond Process Improvement through Silicon Die Polyimide Removal. Journal of Engineering Research and Reports , 33–37. https://doi.org/10.9734/jerr/2020/v12i117073

Affiliations

Anthony R. Moreno — New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.
Jonalyn E. Jaylo — New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.
Frederick Ray I. Gomez — New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.
Edwin M. . Graycochea Jr — New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.

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