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Research Article Open access CC BY 4.0

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Jefferson Talledo

Journal of Engineering Research and Reports · pp. 46–51 · Published 17 Apr 2021

10.9734/jerr/2021/v20i517311

Abstract

Thinner semiconductor package is becoming popular especially in consumer electronics applications. As package becomes thinner, it is more vulnerable to package crack when subjected to external load. It is important to ensure that the package is strong enough to resist package cracking. This paper presents the study of package flexural strength under different epoxy mold compound curing condition. A 3-point bend test was done to characterize the breaking strength of the package that was subjected to post-mold curing. It was then compared to the strength of the package not subjected to post-mold curing (PMC). Results of the bend testing showed that the package flexural strength is much lower when the package is not subjected to post-mold curing. This study demonstrates that the measurement of flexural strength can be used to determine if the package has undergone post-mold curing or not. Performing the right post-mold curing of the thin molded package is required to ensure higher flexural strength.

Flexural strength curing condition thin package package crack 3-point bend test

Cited by 4

Flip-chip package solder-underfill reliability using finite element analysis

Niño Rigo Emil G. Lim, Aristotle T. Ubando, Jeremias A. Gonzaga · Results in Engineering · 2024

Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package

Jeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh · Materials Science in Semiconductor Processing · 2022

Showing 3 of 4 known citations — external sources report more than can currently be individually listed.

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