Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and...
Open access
Research Article10.9734/jerr/2021/v20i917367
New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major mac...
Open access
Research Article10.9734/jerr/2021/v20i517306
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents an improvement done in quad-flat no-leads (QFN) leadframe package to resolve the quantity of unit rejection due to leads scratch under...
Open access
Research Article10.9734/jerr/2020/v15i117136
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability...
Open access
Research Article10.9734/jerr/2021/v20i717351