Semiconductor Package Design Solution for Addressing High-Density Configuration
Rennier Rodriguez, Frederick Ray Gomez, Maiden Grace Maming
Journal of Engineering Research and Reports · pp. 1–6 · Published 27 Aug 2020
10.9734/jerr/2020/v16i317166Abstract
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed through augmentation of routing channels at the backside of the silicon die to eliminate the substrate application in the package. Routed channels are fabricated using plating or immersion process that are electrically connected to the bonding pads through conductive via within the silicon material. By eliminating the substrate re-distribution layers (RDL), a package is expected to decrease by 20 – 40% from its designed dimension.
Cited by 0
No indexed citations yet.
Related research
- Production of Glucoamylase from Fungi using Agro Residues as a Substrate — shares topic coverage
- Impact of Different Substrates and Mother Cultures on Yield and Yield Attributes of Oyster Mushroom (Pleurotus ostreatus) — shares topic coverage
- Effects of Seed Weight and Substrate on Germination and Growth of Non-toxic Jatropha curcas L. Seedings — shares topic coverage
- Double Impact Model for Deciphering Substrate Uptake by Bacteria under Controlled Nutrient Release Conditions — shares topic coverage
- Performance Evaluation of Different Accession of Anacardium occidentale L. Seed under Various Substrates — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.