Thinner semiconductor package is becoming popular especially in consumer electronics applications. As package becomes thinner, it is more vulnerable to package crack when subjected to external load. It is important to ensure that the package is strong enough to resist package cra...
Open access
Research Article10.9734/jerr/2021/v20i517311
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...
Open access
Research Article10.9734/jerr/2021/v20i517310
Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...
Open access
Research Article10.9734/jerr/2021/v20i517308
Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality produc...
Open access
Research Article10.9734/jerr/2021/v20i517309
Die crack is a common problem in the semiconductor industry and being able to predict the breaking force at a given loading condition could help prevent such crack problem. This paper presents the use of mechanical simulation in predicting the force at which the silicon die break...
Open access
Research Article10.9734/jerr/2021/v20i517307
New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major mac...
Open access
Research Article10.9734/jerr/2021/v20i517306
This paper will discuss how to reduce (IDM) Indirect Material consumption for derailing process by eliminating the manual derailing method as part of cost saving project. It involves the removal of cutter blade used for derail.Cost improvement was one of organizational goals of t...
Open access
Research Article10.9734/jerr/2021/v20i517305
Innovations and breakthroughs are continuously driven in semiconductor manufacturing to overcome existing assembly limitations and recurring difficulties. This paper is focused on the resolution of the delamination issue during die attach assembly process. A new design of semicon...
Open access
Research Article10.9734/jerr/2021/v20i417303
In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconduc...
Open access
Research Article10.9734/jerr/2021/v20i417304
Pondi Pius Eddy, Nwigbo Solomon Chuka, Obende Eziekel Omeiza, Olisakwe Henry Chukwuemeka, Chikelu Okechukwu Peter & Azaka Onyemazuwa Andrew·Journal of Engineering Research and Reports·2021
The durability of a machine structure is based on its mechanical performance through its entire service life. To avoid structural failures in machines, it is a standard design practice that machines be analyzed based on the types of loading (static and fatigue) associated with it...
Open access
Research Article10.9734/jerr/2021/v20i417301