Shear strength is the essential engineering property of soil required to analyze and design foundations, retaining walls, bridges, embankment, and related infrastructure. The laboratory equipment and field instruments are not sufficient in developing countries to obtain soil engi...
Open access
Research Article10.9734/jerr/2021/v20i417291
The present study assessed water quality parameters and attempts to compare four different Water Quality Indexes (WQIs) for consistency, similarity and reliability in assessing the water quality of river Benue -an inland river- under wet and dry seasons. The results demonstrate t...
Open access
Research Article10.9734/jerr/2021/v20i417290
This study aims to address the problem of machine saturation and low capacity at package singulation, caused by increasing product loading and new devices that requires frequent machine setups and conversions. With this evaluation, the process and equipment engineering group coll...
Open access
Research Article10.9734/jerr/2021/v20i317289
Osuagwu Andrew Chima, Nkeleme Emmanuel Ifeanyichukwu, Amafili Tochukwu Nnamdi, Ike Goodluck Chukwuemeka & Nzeneri Oluchukwu Precious-favour·Journal of Engineering Research and Reports·2021
The maintenance of public building is evasive without a conscious practice of building surveying as it avails the maintenance personal insight that informs the building maintenance this The research evaluates the practice of building \surveying in South-East Nigeria and its im...
Open access
Research Article10.9734/jerr/2021/v20i317288
This study focuses on eliminating the lead pullback problem in an automotive quad flat no lead (QFN) package in order to meet the non-negotiable requirement to have a solder wettable or solderable lead sidewall. It involves using a non-traditional approach of Monte Carlo toleranc...
Open access
Research Article10.9734/jerr/2021/v20i317287
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line proce...
Open access
Research Article10.9734/jerr/2021/v20i317286
Wirebonding is one of the most challenging assembly manufacturing processes in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to mitigate misplaced ball issues and prevent pattern recognition alignment errors. Parameter optimizat...
Open access
Research Article10.9734/jerr/2021/v20i317283
The optimum mercerization parameters for treatment of corn husk using NaOH were analyzed by response surface methodology (RSM). The surface morphology and chemical structures of the raw and NaOH-treated fibers were studied using scanning electron microscopy (SEM), X-ray diffracti...
Open access
Research Article10.9734/jerr/2021/v20i317284
Die crack is one of the problems in stacked die semiconductor packages. As silicon dies become thinner in such packages due to miniaturization requirement, the tendency to have die crack increases. This study presents the investigation done on a die crack issue in a stacked die p...
Open access
Research Article10.9734/jerr/2021/v20i317285
In the leadframe package assembly process, silicon die is attached to the leadframe using a die attach adhesive material and the bonded strip is then cured. However, excessive strip warpage after the die attach cure process is a challenging problem that also affects the succeedin...
Open access
Research Article10.9734/jerr/2021/v20i317281
The Open time is called the time it takes for this chemical transition from liquid to solid. The epoxy moves into a gel state from the liquid state as it recovers, until it enters a solid-state. This article will address the development of a new, regulatory-compliant in die attac...
Open access
Research Article10.9734/jerr/2021/v20i317280
This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a m...
Open access
Research Article10.9734/jerr/2021/v20i317279
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
The study was conducted to determine the mathematical skills and the academic performance of the junior and senior electrical engineering students of the University of Eastern Philippines. Descriptive-correlational method of research was used with a total enumeration of the regul...
Open access
Research Article10.9734/jerr/2021/v20i317276
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article10.9734/jerr/2021/v20i317277